The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 24, 2015
Filed:
Feb. 08, 2012
Applicants:
MI Jin Park, Gyunggi-do, KR;
Christian Romero, Gyunggi-do, KR;
Seung Wook Park, Seoul, KR;
Inventors:
Assignee:
Samsung Electro-Mechanics Co., Ltd., Gyunggi-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49827 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/16225 (2013.01); H01L 23/49838 (2013.01);
Abstract
Disclosed herein is a semiconductor package including: a semiconductor chip having a bonding pad; and a first substrate including a rerouting layer having short type rerouting patterns electrically connected with the bonding pad and formed to be seamlessly connected with each other and a plurality of open type rerouting patterns separately formed on the same layer as the short type rerouting patterns and connection terminals for signal connection each formed on the open type rerouting patterns.