The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 24, 2015

Filed:

May. 16, 2014
Applicant:

Panasonic Corporation, Kadoma-shi, Osaka, JP;

Inventors:

Masanori Minamio, Osaka, JP;

Zyunya Tanaka, Osaka, JP;

Shin-ichi Ijima, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/433 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); B29C 45/14 (2006.01); H01L 23/367 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49537 (2013.01); H01L 23/4334 (2013.01); H01L 23/49541 (2013.01); H01L 23/49562 (2013.01); H01L 23/49575 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/49171 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/13091 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48257 (2013.01); H01L 2224/48464 (2013.01); H01L 2224/4903 (2013.01); H01L 2224/45124 (2013.01); H01L 2924/13055 (2013.01); H01L 2224/45144 (2013.01); H01L 23/3107 (2013.01); H01L 21/565 (2013.01); H01L 21/568 (2013.01); B29C 45/14221 (2013.01); B29C 45/14655 (2013.01); H01L 2924/3025 (2013.01); H01L 23/367 (2013.01); H01L 24/66 (2013.01); H01L 2924/1306 (2013.01); H01L 2924/1305 (2013.01);
Abstract

A semiconductor device of the present invention comprises: an outer package; a first lead frame including a first relay lead, a first die pad with a power element mounted thereon, and a first external connection lead which has an end protruding from the outer package; and a second lead frame including a second relay lead, a second die pad with a control element mounted thereon, and a second external connection lead which has an end protruding from the outer package, wherein the first die pad and the second die pad or the first external connection lead and the second relay lead are joined to each other at a joint portion, and an end of the second relay lead extending from a joint portion with the first relay lead is located inside the outer package.


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