The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 24, 2015

Filed:

Jan. 04, 2011
Applicants:

Stefan Hilf, Rodenbach, DE;

Friedrich Georg Schmidt, Haltern am See, DE;

Andre Hennig, Ingelheim, DE;

Simon Krause, Aschaffenburg, DE;

Christopher Barner-kowollik, Stutensee, DE;

Andrew John Inglis, Blakehurst, AU;

Leena Nebhani, Rajasthan, IN;

Inventors:

Stefan Hilf, Rodenbach, DE;

Friedrich Georg Schmidt, Haltern am See, DE;

Andre Hennig, Ingelheim, DE;

Simon Krause, Aschaffenburg, DE;

Christopher Barner-Kowollik, Stutensee, DE;

Andrew John Inglis, Blakehurst, AU;

Leena Nebhani, Rajasthan, IN;

Assignee:

Evonik Roehm GmbH, Darmstadt, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 33/12 (2006.01); C08F 120/10 (2006.01); C08L 45/00 (2006.01); C08L 33/08 (2006.01); C08L 81/00 (2006.01); C09J 4/00 (2006.01); C08F 8/00 (2006.01); C08F 8/26 (2006.01); C08F 8/34 (2006.01); C08G 81/02 (2006.01); C08J 3/24 (2006.01); C09D 11/00 (2014.01); C08K 5/38 (2006.01);
U.S. Cl.
CPC ...
C09J 4/00 (2013.01); C08F 8/00 (2013.01); C08F 8/26 (2013.01); C08F 8/34 (2013.01); C08G 81/02 (2013.01); C08J 3/246 (2013.01); C09D 11/00 (2013.01); C08K 5/38 (2013.01);
Abstract

The present invention relates to an innovative method for controlling the viscosity of, for example, adhesives or coating formulations. The method for controlling viscosity allows very rapid thermoplastic curing of a formulation even at room temperature and a significant reduction in the viscosity at higher temperatures, thereby regaining the capacity for simple processing and allowing, for example, the originally bonded substrates to be separated from one another again with ease. A particular aspect in this context is that a plurality of cycles of thermoplastic curing and a significant reduction in the viscosity are possible with the present system.


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