The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 24, 2015

Filed:

Jan. 03, 2012
Applicants:

Eric Grobelny, St. Petersburg, FL (US);

David Paul Campagna, St. Petersburg, FL (US);

David J. Kessler, Tampa, FL (US);

Inventors:

Eric Grobelny, St. Petersburg, FL (US);

David Paul Campagna, St. Petersburg, FL (US);

David J. Kessler, Tampa, FL (US);

Assignee:

Honeywell International Inc., Morristown, NJ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/82 (2006.01); H01L 21/8234 (2006.01); H01L 25/065 (2006.01); H01L 23/48 (2006.01); H01L 25/18 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 21/823475 (2013.01); H01L 23/481 (2013.01); H01L 25/18 (2013.01); H01L 2225/06544 (2013.01); H01L 2225/06565 (2013.01); H01L 2924/00 (2013.01); H01L 2924/00012 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A processing unit comprises a plurality of individual integrated circuits (ICs) electrically connected to one another via a common configuration of electrical interconnects (e.g., through-silicon vias). At least two of the ICs may be configured for a different function. In some examples, the processing unit is formed by selecting the ICs from stored groups of ICs. The stored ICs can be, for example, modular ICs in that the ICs can be mixed and matched in any suitable number or type in order to meet a particular set of functional requirements for the processing unit, which may depend on the application for the processing unit. Electrical coupling of these individual ICs via the electrical interconnects of the ICs results in a single processing unit that is configured to perform functions specifically suited for a particular application or set of applications.


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