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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8987061 B1

PDFFull Text
Date of Patent:
Mar. 24, 2015

Filed:

Jun. 19, 2014

Methods for antenna switch modules

Applicant:

Skyworks Solutions, Inc., Wobum, MA (US);

Inventors:

Jong-Hoon Lee, San Diego, CA (US);

Chuming Shih, Chandler, AZ (US);

Assignee:

Skyworks Soultions, Inc., Woburn, MA (US);

Attorney:

Knobbe, Martens, Olson & Bear, LLP

Primary Examiner:

Daniel Whalen

Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/34 (2006.01); H01Q 1/50 (2006.01); H01L 23/66 (2006.01); H01L 23/64 (2006.01); H01L 25/16 (2006.01); H01L 21/84 (2006.01); H01L 23/498 (2006.01); H01L 27/13 (2006.01); H01L 49/02 (2006.01); H01P 11/00 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/50 (2013.01); H01L 23/66 (2013.01); H01L 23/642 (2013.01); H01L 23/645 (2013.01); H01L 25/16 (2013.01); H01L 21/84 (2013.01); H01L 23/49822 (2013.01); H01L 23/49838 (2013.01); H01L 27/13 (2013.01); H01L 28/10 (2013.01); H01L 28/40 (2013.01); H01P 11/001 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48237 (2013.01); H01L 2224/49171 (2013.01); H01L 2924/30107 (2013.01);
Abstract

Methods for antenna switch modules are disclosed. In certain implementations, a method of making an antenna switch module is provided. The method includes providing a package substrate implemented to receive one or more electrical components, attaching a silicon on insulator (SOI) die to the package substrate, and providing an integrated filter. The SOI die includes a capacitor and a switch coupled to a plurality of radio frequency (RF) signal paths. The integrated filter filters an RF signal received on a first RF signal path of the plurality of RF signal paths, and includes the capacitor of the SOI die and an inductor.

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