The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 24, 2015

Filed:

Aug. 06, 2010
Applicants:

Antonius Maria Bernardus Van Mol, Eindhoven, NL;

Joanne Sarah Wilson, Dordrecht, NL;

Chia-chen Fan, The Hague, NL;

Herbert Lifka, Son en Breugel, NL;

Edward Willem Albert Young, Maastricht, NL;

Hieronymus A.j.m. Andriessen, Beerse, BE;

Inventors:

Antonius Maria Bernardus van Mol, Eindhoven, NL;

Joanne Sarah Wilson, Dordrecht, NL;

Chia-Chen Fan, The Hague, NL;

Herbert Lifka, Son en Breugel, NL;

Edward Willem Albert Young, Maastricht, NL;

Hieronymus A.J.M. Andriessen, Beerse, BE;

Assignee:

Koninklijke Philips N.V., Eindhoven, NL;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 51/52 (2006.01); H01L 51/00 (2006.01);
U.S. Cl.
CPC ...
H01L 51/5206 (2013.01); H01L 51/5221 (2013.01); H01L 51/003 (2013.01); H01L 2227/326 (2013.01); H01L 2251/5361 (2013.01);
Abstract

A method of manufacturing an opto-electric device is disclosed, comprising the steps of providing a substrate (), overlying a first main side of the substrate with an electrically interconnected open shunting structure (), embedding the electrically interconnected open shunting structure in a transparent layer (), removing the substrate from the embedded electrically interconnected open shunting structure, depositing a functional layer structure () over a free surface () formed after removal of the substrate.


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