The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 24, 2015

Filed:

Jun. 23, 2009
Applicants:

Jae Jun Lee, Suwon-si, KR;

Mahn Jong Kim, Daejeon, KR;

Kwang Hee Kim, Seoul, KR;

Inventors:

Jae Jun Lee, Suwon-si, KR;

Mahn Jong Kim, Daejeon, KR;

Kwang Hee Kim, Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 63/685 (2006.01); C08G 73/00 (2006.01); C08J 5/24 (2006.01); C08L 67/00 (2006.01); C08L 77/00 (2006.01); C08G 73/10 (2006.01); C08G 73/02 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
C08G 73/101 (2013.01); C08G 63/685 (2013.01); C08G 73/026 (2013.01); C08J 5/24 (2013.01); C08J 2377/12 (2013.01); C08J 2379/08 (2013.01); H05K 1/032 (2013.01);
Abstract

A thermosetting oligomer or thermosetting polymer is provided. The thermosetting oligomer or thermosetting polymer contains repeating units, each of which has at least one thermosetting functional group in the side chain and is represented by Formula 1: where repeating units include X, A, and Ysubunits, sidechain units include linking unit L and thermosetting functional group Z, and n is an integer from 1 to 4. The thermosetting oligomer or thermosetting polymer has a low coefficient of thermal expansion and high or no glass transition temperature, stiffness, processability, heat resistance and mechanical properties. The thermosetting oligomer or thermosetting polymer is highly soluble, wettable and dimensionally stable and is suitable for use in films, prepregs and printed circuit boards. Further provided are a thermosetting resin composition including the thermosetting oligomer or thermosetting polymer and a printed circuit board using the composition.


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