The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 24, 2015
Filed:
Jul. 13, 2012
Applicants:
Kenji Uchida, Kanagawa, JP;
Koki Hirasawa, Kanagawa, JP;
Inventors:
Kenji Uchida, Kanagawa, JP;
Koki Hirasawa, Kanagawa, JP;
Assignee:
Renesas Electronics Corporation, Kanagawa, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 45/14 (2006.01); H01L 31/0203 (2014.01); H01L 27/146 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 31/0203 (2013.01); B29C 45/1418 (2013.01); B29C 45/14655 (2013.01); H01L 27/14618 (2013.01); H01L 24/97 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2924/1815 (2013.01); H01L 2224/97 (2013.01); H01L 2924/3025 (2013.01);
Abstract
The electronic device, which allows inhibiting the breaking-away of the element from the frame member, even if the temperature change of the electronic device is repeated, and the process for manufacturing the electronic device, are achieved. An electronic device includes a photo-sensitive element formed in a wafer, a frame member installed on the wafer to surround a functional unit, and an encapsulating resin layer filling a circumference of the frame member.