The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 24, 2015
Filed:
Dec. 28, 2011
Rafil A. Basheer, Rochester Hills, MI (US);
Rafil A. Basheer, Rochester Hills, MI (US);
King Fahd University of Petroleum and Minerals, Dhahran, SA;
Abstract
The high impact strength conductive adhesive is a mixture formed from a bisphenol A-based epoxy resin, a curing agent, and silver flakes. In one embodiment, the bisphenol A-based epoxy resin forms about 10.5 wt % of the mixture and the curing agent forms about 14.5 wt % of the mixture, the balance being silver flakes. In this embodiment, the curing agent is preferably an oligomeric polyamine curing agent, such as amidoamine-polyoxypropylenediamine t-butyl phenol. Each silver flake preferably has a tap density of between about 4.0 g/cmand about 5.8 g/cm, and a surface area of between about 0.8 m/g and about 0.3 m/g. In an alternative embodiment, the bisphenol A-based epoxy resin forms about 11.7 wt % of the mixture and the curing agent forms about 16.3 wt % of the mixture, the balance being silver flakes.