The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 24, 2015

Filed:

Oct. 22, 2009
Applicants:

Yuichiro Akiba, Ohtsu, JP;

Tomoko Honda, Tokyo, JP;

Fujio Takahashi, Tokyo, JP;

Shinji Nakata, Tokyo, JP;

Inventors:

Yuichiro Akiba, Ohtsu, JP;

Tomoko Honda, Tokyo, JP;

Fujio Takahashi, Tokyo, JP;

Shinji Nakata, Tokyo, JP;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 1/00 (2006.01); H01B 1/12 (2006.01); H01Q 1/38 (2006.01); C09D 11/10 (2014.01); C09D 11/52 (2014.01); H01B 1/22 (2006.01); H05K 1/09 (2006.01); H05K 1/02 (2006.01); H05K 3/24 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/38 (2013.01); C09D 11/10 (2013.01); C09D 11/52 (2013.01); H01B 1/22 (2013.01); H05K 1/0284 (2013.01); H05K 1/095 (2013.01); H05K 3/246 (2013.01); H05K 2201/0347 (2013.01);
Abstract

A conductive paste containing a conductive powder (A), a vinyl chloride-vinyl acetate resin (B), a polyester resin and/or polyurethane resin (C), a blocked isocyanate (D) blocked with an active methylene compound, and an organic solvent (E), wherein the resin (C) has a glass transition temperature of −50° C. to 20° C., a sum of amounts of the resin (C) is 50 to 400 parts by weight relative to 100 parts by weight of the resin (B), and a sum of amounts of the resin (B), the resin (C) component, and the blocked isocyanate (D) is 10 to 60 parts by weight relative to 100 parts by weight of the conductive powder (A). An electric wiring in which this conductive paste is formed on an insulating substrate.


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