The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 24, 2015

Filed:

Mar. 31, 2011
Applicants:

Hiroyuki Morita, Tokyo, JP;

Yoshihiko Minachi, Tokyo, JP;

Takahiro Mori, Tokyo, JP;

Tatsuya Kato, Tokyo, JP;

Nobuhiro Suto, Tokyo, JP;

Naoto Oji, Tokyo, JP;

Inventors:

Hiroyuki Morita, Tokyo, JP;

Yoshihiko Minachi, Tokyo, JP;

Takahiro Mori, Tokyo, JP;

Tatsuya Kato, Tokyo, JP;

Nobuhiro Suto, Tokyo, JP;

Naoto Oji, Tokyo, JP;

Assignee:

TDK Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C04B 35/26 (2006.01); C04B 35/64 (2006.01); C22C 33/02 (2006.01); B22F 3/22 (2006.01); H01F 1/11 (2006.01); H01F 7/02 (2006.01); H01F 41/02 (2006.01);
U.S. Cl.
CPC ...
C22C 33/0278 (2013.01); B22F 3/225 (2013.01); B22F 2998/10 (2013.01); H01F 1/11 (2013.01); H01F 7/021 (2013.01); H01F 41/0266 (2013.01);
Abstract

The present invention aims to ensure strength of a thin-walled sintered magnet. A sintered magnet is a ferrite sintered magnet made by sintering a magnetic material. A magnetic powder mixture obtained by mixing magnetic powder with a binder resin is injection-molded into a mold with a magnetic field applied thereto to produce a molded body, which is then sintered to produce the sintered magnet. The sintered magnet has a thickness of 3.5 mm or less in the position of center of gravity thereof. The sintered magnet has a surface roughness Rz of 0.1 μm or more and 2.5 μm or less. The surface roughness Rz is a 10 point average roughness.


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