The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8986523 B1

PDF
Full Text
Expired
Date of Patent:
Mar. 24, 2015

Filed:

Jan. 19, 2012
Applicants:

Kristin M. Ackerson, Colchester, VT (US);

John J. Ellis-monaghan, Grand Isle, VT (US);

Jeffrey P. Gambino, Westford, VT (US);

Yen LI Lim, Essex Junction, VT (US);

Polina A. Razina, Amherst, MA (US);

Inventors:

Kristin M. Ackerson, Colchester, VT (US);

John J. Ellis-Monaghan, Grand Isle, VT (US);

Jeffrey P. Gambino, Westford, VT (US);

Yen Li Lim, Essex Junction, VT (US);

Polina A. Razina, Amherst, MA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G01N 27/327 (2006.01); G01R 27/26 (2006.01); G01N 27/22 (2006.01); H01L 23/00 (2006.01); H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
G01N 27/3276 (2013.01); G01N 27/22 (2013.01); H01L 23/5223 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 2224/4847 (2013.01); H01L 24/45 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 24/03 (2013.01); H01L 24/48 (2013.01); H01L 2224/036 (2013.01); H01L 2224/05157 (2013.01); H01L 2224/0518 (2013.01); H01L 2224/05181 (2013.01); H01L 2224/05184 (2013.01); H01L 2224/05186 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/13101 (2013.01); H01L 2924/1306 (2013.01);
Abstract

A biosensor capacitor, including a dielectric layer; a first metal layer in the dielectric layer; a passivation layer over the dielectric layer and the first metal layer; an isolation layer over the passivation layer; a probe DNA electrode connected to the first metal layer; a counter electrode connected to the first metal layer wherein the counter electrode forms an enclosure around the probe DNA electrode; and a bond pad connected to the first metal layer.


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