The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 24, 2015

Filed:

Apr. 05, 2012
Applicants:

Bae Sun Kim, Daejeon, KR;

Yong Ki Son, Daejeon, KR;

Ji Eun Kim, Daejeon, KR;

Sung Yong Shin, Daejeon, KR;

Inventors:

Bae sun Kim, Daejeon, KR;

Yong Ki Son, Daejeon, KR;

Ji Eun Kim, Daejeon, KR;

Sung yong Shin, Daejeon, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/02 (2006.01); H05K 1/00 (2006.01); H05K 1/03 (2006.01); H05K 3/20 (2006.01);
U.S. Cl.
CPC ...
H05K 1/038 (2013.01); H05K 3/20 (2013.01); H05K 3/205 (2013.01); H05K 2203/0156 (2013.01); H05K 2203/068 (2013.01);
Abstract

Methods for manufacturing a fabric-type circuit board, including: forming a metal plating layer on a base substrate, forming a circuit pattern by etching the metal plating layer, bonding a carrier film on the circuit pattern, and bonding an adhesive film directly below the circuit pattern after removing the base substrate; or bonding an adhesive film to a metal thin film, forming a circuit pattern by etching the metal thin film, and bonding a carrier film on the circuit pattern. In either case, the circuit pattern is transferred to a fabric by bonding the adhesive film to the fabric.


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