The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 2015
Filed:
Feb. 02, 2012
Hideki Watanabe, Kanagawa, JP;
Rintaro Koda, Tokyo, JP;
Masaru Kuramoto, Kanagawa, JP;
Kaori Naganuma, Kanagawa, JP;
Hiroyuki Yokoyama, Miyagi, JP;
Hideki Watanabe, Kanagawa, JP;
Rintaro Koda, Tokyo, JP;
Masaru Kuramoto, Kanagawa, JP;
Kaori Naganuma, Kanagawa, JP;
Hiroyuki Yokoyama, Miyagi, JP;
Sony Corporation, Tokyo, JP;
Tohoku University, Miyagi, JP;
Abstract
A submount having a structure and a configuration resistant to an increase in manufacturing cost and a reduction in yields or reliability, and including an oblique waveguide is provided. A submount having a first surface and allowing a semiconductor light-emitting element including a waveguide to be fixed on the first surface, the waveguide having an axis line inclined at θ(degrees) with respect to a normal to a light-incident/emission end surface of the semiconductor light-emitting element, and made of a semiconductor material with a refractive index n, the submount includes: a fusion-bonding material layer on the first surface; and an alignment mark formed in the fusion-bonding material layer, the alignment mark allowed to be recognized at an angle θ=sin[n·sin(θ)/n], where a refractive index of a light-transmitting medium in proximity to the outside of the light-incident/emission end surface of the semiconductor light-emitting element is n.