The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 17, 2015

Filed:

May. 24, 2012
Applicants:

Mauro Scandiuzzo, Torrazza di Cambiago, IT;

Luca Perilli, Teramo, IT;

Roberto Canegallo, Rimini, IT;

Inventors:

Mauro Scandiuzzo, Torrazza di Cambiago, IT;

Luca Perilli, Teramo, IT;

Roberto Canegallo, Rimini, IT;

Assignee:

STMicroelectronics S.R.L., Agrate Brianza (MB), IT;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/10 (2006.01); H01L 23/48 (2006.01); H01L 23/64 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01); G01R 31/302 (2006.01); H05K 1/02 (2006.01); H01L 23/522 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/48 (2013.01); H01L 23/642 (2013.01); H01L 25/0652 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); G01R 31/3025 (2013.01); H05K 1/0239 (2013.01); H01L 23/5223 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2225/06513 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/19015 (2013.01); H01L 2924/19041 (2013.01); H01L 24/16 (2013.01); H01L 24/17 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/1703 (2013.01); H01L 2224/73207 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06517 (2013.01); H01L 2924/00013 (2013.01); H01L 2924/01079 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06531 (2013.01); H05K 1/0243 (2013.01); H05K 1/0245 (2013.01); H05K 1/0259 (2013.01); H05K 2201/0191 (2013.01); H05K 2201/099 (2013.01); H01L 2224/16225 (2013.01);
Abstract

Contactless differential coupling structures can be used to communicate signals between circuits located on separate chips or from one chip to a probing device. The contactless coupling structures avoid problems (breaks, erosion, corrosion) that can degrade the performance of ohmic-type contact pads. The contactless coupling structures comprise pairs of conductive pads placed in close proximity. Differential signals are applied across a first pair of differential pads, and the signals are coupled wirelessly to a mating pair of conductive pads. Circuitry for generating and receiving differential signals is described.


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