The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 2015
Filed:
Dec. 26, 2012
Hon Hai Precision Industry Co., Ltd., New Taipei, TW;
Shin-Wen Chen, New Taipei, TW;
Wen-Chang Chen, New Taipei, TW;
Yu-Tsan Cheng, New Taipei, TW;
Yu-Shu Lin, New Taipei, TW;
Chien-Liang Chou, New Taipei, TW;
Hon Hai Precision Industry Co., Ltd., New Taipei, TW;
Abstract
An image sensor module includes a ceramic substrate, an image sensor, a conductive film, a flexible print circuit board (FPCB), and a stiffening plate. The ceramic substrate includes an upper surface and a lower surface opposite to the upper surface, the ceramic substrate defines a transparent hole on the upper surface and a receiving recess on the lower surface. The transparent hole communicates with the receiving recess. The image sensor is received in the receiving recess and is electrically connected to the ceramic substrate. The FPCB is electrically connected to the lower surface of the ceramic substrate by the conductive film. The stiffening plate is positioned on one side of the FPCB opposite to the ceramic substrate.