The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 17, 2015

Filed:

Dec. 21, 2012
Applicant:

Panasonic Corporation, Kadoma-shi, Osaka, JP;

Inventors:

Masato Tobinaga, Hyogo, JP;

Hirotsugu Fusayasu, Kyoto, JP;

Masafumi Kumoi, Osaka, JP;

Ryuichi Nagaoka, Osaka, JP;

Yoshio Nishizawa, Osaka, JP;

Atsushi Inoue, Tokushima, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 3/14 (2006.01); H04N 5/335 (2011.01); H04N 5/225 (2006.01); H04N 5/357 (2011.01); H04N 101/00 (2006.01);
U.S. Cl.
CPC ...
H04N 5/2253 (2013.01); H04N 5/3577 (2013.01); H04N 2101/00 (2013.01);
Abstract

An imaging device includes: an imaging sensor; a main circuit substrateincludes a first ground conductor; an imaging sensor cablethat includes a second ground conductor, has the imaging sensormounted thereon, and is connected to the main circuit substrate; a metal platethat is disposed between the main circuit substrateand an area of the imaging sensor cablewhere the imaging sensoris mounted thereon, and that is electrically connected to the second ground conductor; and a ground connection conductorthat electrically connects between the first ground conductor and the metal plate. The ground connection conductoris disposed in an area where the imaging sensorand the imaging sensor cableoverlap each other or in an area where the imaging sensorand the main circuit substrateoverlap each other.


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