The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 17, 2015

Filed:

May. 26, 2010
Applicants:

Satoshi Nakamura, Yokohama, JP;

Takashi Suga, Yokohama, JP;

Yutaka Uematsu, Kawasaki, JP;

Inventors:

Satoshi Nakamura, Yokohama, JP;

Takashi Suga, Yokohama, JP;

Yutaka Uematsu, Kawasaki, JP;

Assignee:

Hitachi, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 29/26 (2006.01); G01R 31/08 (2006.01); G01R 31/00 (2006.01); G01R 31/28 (2006.01); H05K 9/00 (2006.01); H05K 1/02 (2006.01); H05K 1/14 (2006.01); H05K 3/32 (2006.01);
U.S. Cl.
CPC ...
G01R 31/001 (2013.01); G01R 29/26 (2013.01); G01R 31/281 (2013.01); H05K 1/0215 (2013.01); H05K 1/0234 (2013.01); H05K 1/141 (2013.01); H05K 3/325 (2013.01); H05K 9/0039 (2013.01); H05K 9/0069 (2013.01); H05K 2201/10022 (2013.01); H05K 2201/10409 (2013.01); H05K 2201/2036 (2013.01);
Abstract

A noise current passing through a substrate on which an electronic component is mounted is suppressed in a housing, to provide a malfunction of an electronic device. A substrate () on which an electronic component is mounted is secured to a housing () by a metal spacer () and a screw (). A noise control member () mainly composed of an insulation substance is disposed between the metal spacer () and the substrate (). A first conductive film is formed on the metal spacer-side of the noise control member (), and a second conductive film is formed on the substrate-side of the noise control member (). A resistance member () is disposed between the first conductive film and the second conductive film. A noise current introduced from the housing to the substrate can be suppressed by the resistance member.


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