The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8981629 B1

PDF
Full Text
Expired
Date of Patent:
Mar. 17, 2015

Filed:

Mar. 13, 2013
Applicant:

Albeo Technologies, Inc., Boulder, CO (US);

Inventors:

Ming Kong, Boulder, CO (US);

John Powell, Boulder, CO (US);

Jeffrey Bisberg, Boulder, CO (US);

Assignee:

Albeo Technologies, Inc., Boulder, CO (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 1/02 (2006.01); F21V 29/00 (2006.01); H01L 33/58 (2010.01); H01L 33/62 (2010.01); H01L 25/075 (2006.01); H01L 33/54 (2010.01); H05K 1/05 (2006.01);
U.S. Cl.
CPC ...
F21V 29/22 (2013.01); H01L 33/58 (2013.01); H01L 33/62 (2013.01); H01L 25/0753 (2013.01); H01L 33/54 (2013.01); H05K 1/056 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/48137 (2013.01);
Abstract

An LED-based lighting assembly includes a heat sink having at least one pedestal with an upwardly facing, upper planar surface that is raised in a vertical direction relative to an upwardly facing, lower planar surface of the heat sink. A PCB forms an aperture corresponding to the pedestal, includes electrical conductors on an upper surface thereof, and is attached to the lower planar surface. The upper planar surface extends into the aperture, and one or more LED chips attach directly to the upper planar surface and connect to the conductors such that light emits upwardly. A method of integrating LEDs with a heat sink includes mounting a PCB to a planar surface of the heat sink, mounting one or more LED chips to a raised surface of the heat sink that is not covered by the PCB, and electrically connecting the LED chips to conductors on the PCB.


Find Patent Forward Citations

Loading…