The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 2015
Filed:
Nov. 14, 2013
Applicant:
Hyun-ki Kim, Cheonan-si, KR;
Inventor:
Hyun-Ki Kim, Cheonan-si, KR;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/10 (2006.01); H01L 23/34 (2006.01);
U.S. Cl.
CPC ...
H01L 23/34 (2013.01);
Abstract
A lower package includes a semiconductor chip. A first upper package and a second upper package are disposed on the lower package. A heat spreader is disposed on the lower package. The heat spreader includes an upper plate and an extension part connected to the upper plate. At least a part of each of the first and second upper packages vertically overlaps the semiconductor chip. The upper plate may be arranged on the first upper package and the second upper package. The extension part may be arranged between the first upper package and the second upper package. The extension part has a vertical height that is greater than its horizontal width.