The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 2015
Filed:
Sep. 20, 2013
Applicant:
Stmicroelectronics (Crolles 2) Sas, Crolles, FR;
Inventors:
Philippe Delpech, Meylan, FR;
Eric Sabouret, Saint Ismier, FR;
Sebastien Gallois-Garreignot, Grenoble, FR;
Assignee:
STMicroelectronics (Crolles 2) SAS, Crolles, FR;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/00 (2006.01); H01L 21/50 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 21/50 (2013.01); H01L 24/05 (2013.01); H01L 2224/02235 (2013.01);
Abstract
A semiconductor device may include at least one pad adjacent a top surface of the device, and a metal crack stop structure below the at least one pad. The metal crack structure may have an inner envelope and an outer envelope, and may be configured to be vertically aligned with the at least one pad so that an edge of the at least one pad is between the inner and outer envelopes.