The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 2015
Filed:
Jul. 10, 2013
Kong Bee Tiu, Port Klang, MY;
Ruzaini B. Ibrahim, Bandar Puncak Alam, MY;
Wai Yew Lo, Petaling Jaya, MY;
Kong Bee Tiu, Port Klang, MY;
Ruzaini B. Ibrahim, Bandar Puncak Alam, MY;
Wai Yew Lo, Petaling Jaya, MY;
Freescale Semiconductor, Inc., Austin, TX (US);
Abstract
A Quad Flat Package (QFP) semiconductor device has a multi-stepped lead frame for forming rows of external contacts. A semiconductor die is attached to a die pad of the lead frame and electrically connected to lead with bond wires. The die and bond wires are encapsulated with a mold compound and then multiple cuts are made to the lead frame to form the rows of external contacts.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile