The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 2015
Filed:
Nov. 21, 2012
Robert Bosch Gmbh, Stuttgart, DE;
Ricardo Ehrenpfordt, Korntal-Muenchingen, DE;
Mathias Bruendel, Stuttgart, DE;
Andre Gerlach, Leonberg-Hoefingen, DE;
Christina Leinenbach, Karlsruhe, DE;
Sonja Knies, Rutesheim, DE;
Ando Feyh, Palo Alto, CA (US);
Ulrike Scholz, Korntal, DE;
Robert Bosch GmbH, Stuttgart, DE;
Abstract
A MEMS chip package includes a first chip, a second chip, a first coupling element, and a first redistribution layer. The first chip has a first chip surface and a second chip surface, which is opposite the first chip surface. The second chip has a first chip surface and a second chip surface, which is opposite the first chip surface. The first coupling element couples the first chip surface of the second chip to the first chip surface of the first chip, so that a first cavity is defined between the first chip and the second chip. The first redistribution layer is mounted on the second chip surface of the second chip and is configured to provide contact with a substrate.