The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 2015
Filed:
Apr. 03, 2007
Applicants:
DO Choul Woo, Anyang-si, KR;
Min Hong Kim, Hwaseong-si, KR;
MI Gyeong Ko, Ansan-si, KR;
Inventors:
Assignee:
Seoul Semiconductor Co., Ltd., Ansan-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/60 (2010.01); H01L 33/56 (2010.01); B29C 45/14 (2006.01); C08L 63/00 (2006.01); B29L 11/00 (2006.01);
U.S. Cl.
CPC ...
H01L 33/56 (2013.01); B29C 45/14639 (2013.01); C08L 63/00 (2013.01); B29L 2011/00 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/8592 (2013.01);
Abstract
Disclosed are a method of fabricating a light emitting diode package with a surface treated resin encapsulant and a package fabricated by the method. According to the method of fabricating a light emitting diode package, a resin encapsulant encapsulating a light emitting diode chip is surface treated using plasma. Thus, a bonding force between the surface treated resin encapsulant and a resin molding member covering it is increased.