The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 17, 2015

Filed:

Jul. 24, 2012
Applicant:

Chih-sheng Chou, New Taipei, TW;

Inventor:

Chih-Sheng Chou, New Taipei, TW;

Assignee:

Mildef Crete Inc., New Taipei, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H05K 1/02 (2006.01); H05B 3/22 (2006.01); H05B 3/30 (2006.01); H05B 3/26 (2006.01); H01L 23/34 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0212 (2013.01); H05B 3/26 (2013.01); H01L 23/345 (2013.01);
Abstract

A heating apparatus for heating electronic components on a printed circuit board in low temperature environment includes a printed circuit board, a heating unit, a switch unit, a temperature-sensing unit, an electric power unit, and a control unit. The heating unit, the switch unit, the temperature-sensing unit, and the control unit are fixed connected to the printed circuit board and are electrically connected with the metal lines on the printed circuit board. The heat source is sent to the heat-conducting layer on the printed circuit board through the heat-conducting terminal after the switch unit is conducted by the control unit and the power is sent from the electric power unit to the heating unit. Then, the electronic components are heated with the heat source through the heat-conducting layer, so that the electronic components are in the working temperatures for starting up.


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