The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 17, 2015

Filed:

Dec. 29, 2012
Applicants:

Hong Fu Jin Precision Industry (Wuhan) Co., Ltd., Wuhan, CN;

Hon Hai Precision Industry Co., Ltd., New Taipei, TW;

Inventor:

Feng Zhang, Wuhan, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/03 (2006.01); H05K 1/02 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 1/03 (2013.01); H05K 1/024 (2013.01); H05K 3/3452 (2013.01); H05K 2201/0191 (2013.01); H05K 2201/09727 (2013.01); H05K 2201/09972 (2013.01);
Abstract

A printed circuit board includes a line intensive distribution area, a line sparse distribution area, a solder mask layer, and a signal layer. A first signal line is laid on the signal layer. The first signal line crosses the line intensive distribution area and the line sparse distribution area. The first signal line is narrower in the line intensive distribution area than in the line sparse distribution area. The solder mask layer is thicker in the line intensive distribution area than in the line sparse distribution area.


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