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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8981233 B1

PDFFull Text
Date of Patent:
Mar. 17, 2015

Filed:

Jan. 23, 2014

Conductive member and method for producing the same

Applicant:

Mitsubishi Shindoh Co., Ltd., Tokyo, JP;

Inventors:

Takeshi Sakurai, Aizuwakamatsu, JP;

Seiichi Ishikawa, Aizuwakamatsu, JP;

Kenji Kubota, Aizuwakamatsu, JP;

Takashi Tamagawa, Aizuwakamatsu, JP;

Assignee:

Mitsubishi Shindoh Co., Ltd., Tokyo, JP;

Attorney:

Locke Lord LLP

Primary Examiner:

Timothy Thompson

Assistant Examiner:

Rhadames J Alonzo Miller

Int. Cl.
CPC ...
H05K 1/03 (2006.01); B32B 15/01 (2006.01); C25D 5/50 (2006.01); C25D 5/12 (2006.01); C25D 7/00 (2006.01); H01R 13/03 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
C25D 5/505 (2013.01); C25D 5/12 (2013.01); C25D 5/50 (2013.01); C25D 7/00 (2013.01); H01R 13/03 (2013.01);
Abstract

A method for producing a Cu—Sn layer and an Sn-based surface layer are formed in this order on the surface of a Cu-based substrate through an Ni-based base layer, and the Cu—Sn layer is composed of a CuSn layer arranged on the Ni-based base layer and a CuSnlayer arranged on the CuSn layer; the Cu—Sn layer obtained by bonding the CuSn layer and the CuSnlayer is provided with recessed and projected portions on the surface which is in contact with the Sn-based surface layer; thicknesses of the recessed portions are set to 0.05 μm to 1.5 μm, the area coverage of the CuSn layer with respect to the Ni-based base layer is 60% or higher, and the ratio of the thicknesses of the projected portions to the thicknesses of the recessed portions in the Cu—Sn layer is 1.2 to 5.

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Sakurai, Takeshi. (2015). Conductive member and method for producing the same (U.S. Patent No. 8981233). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8981233

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