The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 2015
Filed:
May. 16, 2014
Meiwa Plastic Industries, Ltd., Yamaguchi, JP;
Ufc Corporation, Taipei, TW;
Masato Takenouchi, Yamaguchi, JP;
Tadatoshi Fujinaga, Yamaguchi, JP;
Erina Kimura, Yamaguchi, JP;
Yu-Chin Lee, Taipei, TW;
Jen-Hai Liao, Taipei, TW;
Sung-Chen Lo, Taipei, TW;
Meiwa Plastic Industries, Ltd., Yamaguchi, TW;
UFC Corporation, Taipei, TW;
Abstract
The present invention provides a novel phosphorus-containing phenolic resin. When the phosphorus-containing phenolic resin is used as an epoxy resin curing agent, the cured product thereof has various excellent properties such as excellent moisture resistance, low permittivity, a low dissipation factor, and excellent adhesion in addition to improved flame retardation. Specifically, the phosphorus-containing phenolic resin of the invention is represented by formula (1). The invention also provides a method for manufacturing the novel phosphorus-containing phenolic resin, a phenolic resin composition including the phosphorus-containing phenolic resin, an epoxy resin curing agent including the phenolic resin composition, an epoxy resin composition including the epoxy resin curing agent and an epoxy resin, a cured product obtained by curing the epoxy resin composition, and a copper-clad laminated plate obtained by using the epoxy resin composition as a matrix resin.