The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 2015
Filed:
Jan. 03, 2008
Hiroko Nakamura, Kanagawa, JP;
Takaaki Kozuki, Kanangawa, JP;
Takayuki Enomoto, Nagasaki, JP;
Yuichi Yamamoto, Kanagawa, JP;
Hiroko Nakamura, Kanagawa, JP;
Takaaki Kozuki, Kanangawa, JP;
Takayuki Enomoto, Nagasaki, JP;
Yuichi Yamamoto, Kanagawa, JP;
Sony Corporation, Tokyo, JP;
Abstract
A substrate polishing method, a semiconductor device and a fabrication method for a semiconductor device are disclosed by which high planarization polishing can be achieved. In the substrate polishing method, two or more different slurries formed from ceria abrasive grains having different BET values from each other are used to carry out two or more stages of chemical-mechanical polishing processing of a polishing object oxide film on a substrate to flatten the polishing object film.