The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 17, 2015

Filed:

Nov. 16, 2012
Applicant:

Phostek, Inc., Hsinchu, TW;

Inventors:

Yen-Chang Hsieh, Hsinchu, TW;

Jinn Kong Sheu, Tainan, TW;

Heng Liu, Sunnyvale, CA (US);

Chun-Chao Li, Taoyuan County, TW;

Ya-Hsuan Shih, Changhua County, TW;

Chia-Nan Chen, Hsinchu County, TW;

Assignee:

Phostek, Inc., Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/322 (2006.01); H01L 33/08 (2010.01); H01L 33/40 (2010.01); H01L 31/076 (2012.01); H01L 27/15 (2006.01); H01L 33/32 (2010.01);
U.S. Cl.
CPC ...
H01L 21/3221 (2013.01); H01L 27/153 (2013.01); H01L 33/08 (2013.01); H01L 33/32 (2013.01); H01L 33/40 (2013.01); H01L 31/076 (2013.01); Y02E 10/548 (2013.01);
Abstract

A method of manufacturing a semiconductor apparatus is disclosed. A first-type doped layer, a second-type doped layer, and an internal electrical connection layer are formed. The internal electrical connection layer is deposited and electrically coupled between the first-type doped layer and the second-type doped layer. In one embodiment, the internal electrical connection layer is formed by using a group IV based precursor and nitrogen based precursor. In another embodiment, the internal electrical connection layer is formed by a mixture comprising a carbon-contained doping source, and the internal electrical connection layer has a carbon concentration greater than 10atoms/cm. In a further embodiment, the internal electrical connection layer is formed at a temperature lower than those of the first-type doped layer and the second-type doped layer.


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