The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 2015
Filed:
Dec. 01, 2011
Applicant:
Cornel P. Cobianu, Bucharest, RO;
Inventor:
Cornel P. Cobianu, Bucharest, RO;
Assignee:
Honeywell Romania s.r.l., , RO;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); G01N 29/02 (2006.01); G01N 29/22 (2006.01); B81C 1/00 (2006.01); B01L 3/00 (2006.01); B82Y 40/00 (2011.01);
U.S. Cl.
CPC ...
G01N 29/022 (2013.01); G01N 29/222 (2013.01); B81C 1/00214 (2013.01); B01L 3/502707 (2013.01); G01N 2291/021 (2013.01); G01N 2291/0255 (2013.01); G01N 2291/0256 (2013.01); G01N 2291/0427 (2013.01); B81B 2201/0214 (2013.01); B81B 2203/0118 (2013.01); B81B 2207/015 (2013.01); B81C 2201/0185 (2013.01); B81C 2203/0118 (2013.01); B81C 2203/0714 (2013.01); B81C 2203/0735 (2013.01); B82Y 40/00 (2013.01);
Abstract
Some embodiments relate to method of fabricating a sensor. The method includes providing a substrate wafer that includes a suspended beam; adding an adhesive layer to the substrate wafer such that the adhesive layer covers portions of the substrate without covering the suspended beam; positioning a cover wafer onto the adhesive layer such that the suspend beam is exposed to ambient air through openings in the cover wafer; and functionalizing the suspended beam by contacting the suspended beam with materials through the opening in the cover wafer.