The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 17, 2015

Filed:

Apr. 28, 2014
Applicant:

Nichia Corporation, Anan-shi, Tokushima, JP;

Inventors:

Masatsugu Ichikawa, Tokushima, JP;

Masahiko Sano, Anan, JP;

Daisuke Sanga, Tokushima, JP;

Toru Takasone, Tokushima, JP;

Shunsuke Minato, Anan, JP;

Assignee:

Nichia Corporation, Anan-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 33/50 (2010.01); H01L 33/00 (2010.01);
U.S. Cl.
CPC ...
H01L 33/50 (2013.01); H01L 33/505 (2013.01); H01L 33/0079 (2013.01); H01L 2933/0041 (2013.01);
Abstract

Provided is a method for manufacturing a light emitting device comprising a light emitting element and an optical part, the method comprising the steps of (i) forming a hydroxyl film on a bonding surface of each of the light emitting element and the optical part by an atomic layer deposition, and (ii) bonding the bonding surfaces of the light emitting element and the optical part with each other, each of the bonding surfaces having the hydroxyl film formed thereon, wherein a substep is repeated at least one time in the step (i), in which substep a first raw material gas and a second raw material gas are sequentially supplied onto the bonding surfaces of the light emitting element and the optical part, and wherein the bonding of the bonding surfaces in the step (ii) is performed without a heating treatment.


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