The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 17, 2015

Filed:

Apr. 18, 2014
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Akira Okada, Tokyo, JP;

Takaya Noguchi, Tokyo, JP;

Norihiro Takesako, Tokyo, JP;

Kinya Yamashita, Tokyo, JP;

Hajime Akiyama, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/66 (2006.01); G01R 31/28 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 22/12 (2013.01); G01R 31/2893 (2013.01); G01R 31/2898 (2013.01); H01L 21/02076 (2013.01);
Abstract

A test apparatus includes a foreign matter removal unit having a first slope provided with an abrasive coating or an adhesive sheet and a second slope provided with an abrasive coating or an adhesive sheet, the second slope facing the first slope in such a manner that an upper end of the second slope is spaced from an upper end of the first slope a greater distance than a lower end of the second slope is spaced from a lower end of the first slope, a test unit for testing electrical characteristics of a semiconductor chip, and a transfer unit for holding and releasing the semiconductor chip at a position above the first and second slopes and transferring the semiconductor chip to the test unit.


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