The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 17, 2015

Filed:

Oct. 31, 2008
Applicants:

Masahiro Takahata, Ibaraki, JP;

Yuichiro Shindo, Ibaraki, JP;

Gaku Kanou, Ibaraki, JP;

Inventors:

Masahiro Takahata, Ibaraki, JP;

Yuichiro Shindo, Ibaraki, JP;

Gaku Kanou, Ibaraki, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C22C 28/00 (2006.01); C21D 1/00 (2006.01); C23C 14/00 (2006.01); C22B 9/22 (2006.01); C22B 59/00 (2006.01); C23C 14/34 (2006.01); H01L 21/28 (2006.01); H01L 21/285 (2006.01); H01L 29/49 (2006.01);
U.S. Cl.
CPC ...
C22C 28/00 (2013.01); C22B 9/228 (2013.01); C22B 59/00 (2013.01); C23C 14/3414 (2013.01); H01L 21/28079 (2013.01); H01L 21/2855 (2013.01); H01L 29/495 (2013.01);
Abstract

Provided are high-purity lanthanum, wherein the purity excluding rare-earth elements and gas components is 4N or higher, and amounts of aluminum, iron and copper in the lanthanum are respectively 100 wtppm or less; as well as high-purity lanthanum, wherein the purity excluding rare-earth elements and gas components is 4N or higher, amounts of aluminum, iron and copper in the lanthanum are respectively 100 wtppm or less, oxygen content is 1500 wtppm or less, elements of alkali metals and alkali earth metals are respectively 1 wtppm or less, elements of transition metals and high-melting-point metals other than those above are respectively 10 wtppm or less, and radioactive elements are respectively 10 wtppb or less. The invention aims to provide technology capable of efficiently and stably providing high-purity lanthanum, a sputtering target comprising high-purity lanthanum, and a thin film for metal gate mainly comprising high-purity lanthanum.


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