The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 17, 2015

Filed:

Jan. 28, 2011
Applicants:

Tomoyuki Adaniya, Tokyo, JP;

Satoshi Okabe, Chiba, JP;

Toshiyuki Gotou, Kanagawa, JP;

Taketo Maruyama, Niigata, JP;

Kazuki Kobayashi, Osaka, JP;

Keiichi Tanaka, Osaka, JP;

Wataru Nakamura, Osaka, JP;

Kenichi Kitoh, Osaka, JP;

Tetsunori Tanaka, Osaka, JP;

Inventors:

Tomoyuki Adaniya, Tokyo, JP;

Satoshi Okabe, Chiba, JP;

Toshiyuki Gotou, Kanagawa, JP;

Taketo Maruyama, Niigata, JP;

Kazuki Kobayashi, Osaka, JP;

Keiichi Tanaka, Osaka, JP;

Wataru Nakamura, Osaka, JP;

Kenichi Kitoh, Osaka, JP;

Tetsunori Tanaka, Osaka, JP;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B44C 1/22 (2006.01); C23F 1/00 (2006.01); C03C 15/00 (2006.01); C03C 25/68 (2006.01); H01L 21/302 (2006.01); H01L 21/461 (2006.01); C09K 13/00 (2006.01); C09K 13/08 (2006.01); H01L 21/3213 (2006.01); C23F 1/18 (2006.01); C23F 1/26 (2006.01); C23F 1/44 (2006.01); H05K 3/06 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 21/32134 (2013.01); C23F 1/18 (2013.01); C23F 1/26 (2013.01); C23F 1/44 (2013.01); H05K 3/067 (2013.01); H01L 23/53238 (2013.01); H01L 2924/0002 (2013.01);
Abstract

The present invention provides an etching liquid for a multilayer thin film containing a copper layer and a titanium layer, and a method of using it for etching a multilayer thin film containing a copper layer and a titanium layer, that is, an etching liquid for a multilayer thin film containing a copper layer and a titanium layer, which comprises (A) hydrogen peroxide, (B) nitric acid, (C) a fluoride ion source, (D) an azole, (E) a quaternary ammonium hydroxide and (F) a hydrogen peroxide stabilizer and has a pH of from 1.5 to 2.5, and a etching method of using it.


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