The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 2015
Filed:
Sep. 28, 2012
Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;
Yoichi Moriya, Nagaokakyo, JP;
Tsuyoshi Katsube, Nagaokakyo, JP;
Yuki Takemori, Nagaokakyo, JP;
Tetsuo Kanamori, Nagaokakyo, JP;
Yasutaka Sugimoto, Nagaokakyo, JP;
Takahiro Takada, Nagaokakyo, JP;
Murata Manufacturing Co., Ltd., Kyoto, JP;
Abstract
In a metal base substrate with a low-temperature sintering ceramic layer located on a copper substrate, bonding reliability is increased between the copper substrate and the low-temperature sintering ceramic layer. A raw laminated body is prepared by stacking, on a surface of a copper substrate, a low-temperature sintering ceramic green layer including a low-temperature sintering ceramic material containing about 10 mol % to about 40 mol % of barium in terms of BaO and about 40 mol % to about 80 mol % of silicon in terms of SiO, and this raw laminated body is subjected to firing at a temperature at which the low-temperature sintering ceramic green layer is sintered. In the thus obtained metal base substrate, a glass layer composed of Cu—Ba—Si based glass with a thickness of about 1 μm to about 5 μm is formed between the metal substrate and the low-temperature sintering ceramic layer.