The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 17, 2015

Filed:

Dec. 16, 2012
Applicants:

Cpumate Inc., New Taipei, TW;

Golden Sun News Techniques Co., Ltd., New Taipei, TW;

Inventors:

Kuo-Len Lin, New Taipei, TW;

Chen-Hsiang Lin, New Taipei, TW;

Ken Hsu, New Taipei, TW;

Chih-Hung Cheng, New Taipei, TW;

Assignees:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); B21D 53/08 (2006.01); F28D 15/04 (2006.01); B21D 22/06 (2006.01); F28D 15/02 (2006.01); F28F 1/32 (2006.01); B21D 22/02 (2006.01);
U.S. Cl.
CPC ...
F28D 15/043 (2013.01); B21D 53/08 (2013.01); B21D 22/06 (2013.01); F28D 15/0266 (2013.01); F28F 1/32 (2013.01); F28D 15/0275 (2013.01); B21D 22/025 (2013.01);
Abstract

A heat conducting structure, a heat sink with the heat conducting structure, and a manufacturing method of the heat conducting structure are disclosed. The manufacturing method includes the steps of providing a first mold () and a second mold () having different concave cambers (), using the first mold () to progressively compress the heat pipes () and form a camber () at an evaporating section (), using the second mold () to compress the camber () to form a contact plane () and an attaching plane () perpendicular to each other, coating an adhesive () on the contact planes (), connecting the contact planes to make the attaching planes co-planar.


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