The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 2015
Filed:
Apr. 11, 2011
Philippe Jacques Pernod, Lille, FR;
Leticia Gimeno Monge, Lille, FR;
Abdelkrim Talbi, La Madeleine, FR;
Alain Merlen, Lille, FR;
Romain Victor Jean Viard, Riedisheim, FR;
Vincent Mortet, Leuven, BE;
Ali Soltani, Villeneuve D'ascq, FR;
Vladimir Preobrazhensky, Villeneuve D'ascq, FR;
Philippe Jacques Pernod, Lille, FR;
Leticia Gimeno Monge, Lille, FR;
Abdelkrim Talbi, La Madeleine, FR;
Alain Merlen, Lille, FR;
Romain Victor Jean Viard, Riedisheim, FR;
Vincent Mortet, Leuven, BE;
Ali Soltani, Villeneuve D'ascq, FR;
Vladimir Preobrazhensky, Villeneuve D'ascq, FR;
Centre National de la Recherche Scientifique, Paris, FR;
Ecole Centrale de Lille, Villeneuve d'Ascq Cedex, FR;
Abstract
The invention relates to a submillimeter-sized hot-wire sensor () comprising a substrate (), two support rods (), a metal wire () extending between the two ends of the support rods (), and electrical contacts () disposed on the support rods, said contacts each being linked to one of the ends of the wire (). The metal wire comprises at least two layers of metal materials, one of said layers being made of a material exhibiting a residual stress under tension and the other layer being made of a material exhibiting a residual stress under compression. The thicknesses of these metal layers are adapted so as to compensate the residual stresses between the various layers.