The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 2015
Filed:
Jan. 17, 2011
William T. Pike, London, GB;
Ian Standley, Claremont, CA (US);
William T. Pike, London, GB;
Ian Standley, Claremont, CA (US);
Kinemetrics, Inc., Pasadena, CA (US);
Abstract
A method of attaching two wafers in a seismometer comprising the steps of forming a patterned wetting metal layer on a first wafer and forming a plurality of cavities mirroring the pattern of the wetting metal layer on the first wafer. The steps further include pouring a plurality of solder balls on the surface of an alignment wafer, pouring off excess solder balls, aligning the first wafer with the alignment wafer, and connecting the first wafer with the alignment wafer. The solder balls are immobilized on the wetting metal layer by performing a partial reflow onto the wetting metal layer and removing the alignment wafer. The first and second wafers are aligned so that each solder ball is immobilized between the first and second wafer. The wafers are then bonded together.