The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8976609 B1

PDF
Full Text
Expired
Date of Patent:
Mar. 10, 2015

Filed:

Jun. 20, 2014
Applicant:

Sandisk Enterprise Ip Llc, Milpitas, CA (US);

Inventors:

Jack Edward Frayer, Boulder Creek, CA (US);

Vidyabhushan Mohan, San Jose, CA (US);

Assignee:

SanDisk Enterprise IP LLC, Milpitas, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 29/00 (2006.01); G11C 29/04 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
G11C 29/04 (2013.01); H01L 22/14 (2013.01); G11C 2029/0403 (2013.01);
Abstract

The various embodiments described herein include systems, methods and/or devices used to packaging non-volatile memory. In one aspect, the method includes, selecting, from a set of non-volatile memory die, a plurality of non-volatile memory die on which predefined die-level and sub-die level tests have been deferred until after packaging, in accordance with predefined criteria and predefined statistical die performance information corresponding to the set of non-volatile memory die. The method further includes packaging the selected plurality of non-volatile memory die into a memory device. After said packaging, the method further includes performing a set of tests on the plurality of non-volatile memory die in the memory device to identify respective units of memory within the non-volatile memory die in the memory device that meet predefined validity criteria, wherein the set of tests performed include the deferred predefined die-level and sub-die level tests.


Find Patent Forward Citations

Loading…