The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 10, 2015

Filed:

Dec. 09, 2011
Applicants:

Wei-hung Lin, Hsinchu County, TW;

Hung-i Chung, Hsinchu County, TW;

Inventors:

Wei-Hung Lin, Hsinchu County, TW;

Hung-I Chung, Hsinchu County, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 1/16 (2006.01); H05K 3/30 (2006.01); H05K 3/32 (2006.01); H05K 1/11 (2006.01); G11C 5/00 (2006.01); H01L 25/00 (2006.01); H05K 3/28 (2006.01); H01R 12/72 (2011.01);
U.S. Cl.
CPC ...
G06F 1/16 (2013.01); H05K 1/117 (2013.01); G11C 5/00 (2013.01); H01L 25/00 (2013.01); H05K 3/284 (2013.01); H05K 2201/09063 (2013.01); H05K 2201/10159 (2013.01); H05K 2201/10189 (2013.01); H01R 12/725 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A storage device including a circuit board, an electronic device package and a terminal module is provided. The circuit board has a first surface and a second surface opposite to each other, a plurality of via-holes connecting the first surface and the second surface, a plurality of first pads on the first surface, and a plurality of first pads on the second surface. The electronic device package is disposed on the first surface. The terminal module disposed on the first surface has a plurality of first and second contact parts, and each of the first contact parts passes through the corresponding via-hole and is protruded out of the second surface, and each of the second contact parts is electrically connected to the corresponding first pad. An orthogonal projection area of the electronic device package on the first surface is smaller than an area of the first surface.


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