The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 10, 2015

Filed:

Sep. 13, 2012
Applicants:

Brett W. Degner, Menlo Park, CA (US);

Patrick Kessler, San Francisco, CA (US);

Charles A. Schwalbach, Menlo Park, CA (US);

Richard H. Tan, Fremont, CA (US);

William F. Leggett, Cupertino, CA (US);

Inventors:

Brett W. Degner, Menlo Park, CA (US);

Patrick Kessler, San Francisco, CA (US);

Charles A. Schwalbach, Menlo Park, CA (US);

Richard H. Tan, Fremont, CA (US);

William F. Leggett, Cupertino, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); F28F 7/00 (2006.01); F28D 15/04 (2006.01); G01F 1/20 (2006.01);
U.S. Cl.
CPC ...
Abstract

The disclosed embodiments provide a system that facilitates heat transfer in an electronic device. The system includes a heat pipe configured to conduct heat away from a heat-generating component in the electronic device. The system also includes a thermal stage disposed along a thermal interface between the heat-generating component and the heat pipe, wherein the thermal stage applies a spring force between the heat-generating component and the heat pipe. The thermal stage includes a first thickness to accommodate the heat pipe and a second thickness that is greater than the first thickness to increase a spring force between the heat-generating component and the heat pipe. Finally, the system includes a set of fasteners configured to fasten the thermal stage to a surface within the electronic device and form a thermal gap between the heat pipe and an enclosure of the electronic device.


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