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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8975759 B1

PDFFull Text
Expired
Date of Patent:
Mar. 10, 2015

Filed:

Sep. 13, 2012

Manufacturing method of semiconductor device, adhesive sheet used therein, and semiconductor device obtained thereby

Applicants:

Sadahito Misumi, Ibaraki, JP;

Takeshi Matsumura, Ibaraki, JP;

Kazuhito Hosokawa, Ibaraki, JP;

Hiroyuki Kondo, Ibaraki, JP;

Inventors:

Sadahito Misumi, Ibaraki, JP;

Takeshi Matsumura, Ibaraki, JP;

Kazuhito Hosokawa, Ibaraki, JP;

Hiroyuki Kondo, Ibaraki, JP;

Assignee:

Nitto Denko Corporation, Osaka, JP;

Attorney:

Knobbe Martens Olson & Bear, LLP

Primary Examiner:

Chuong A Luu

Int. Cl.
CPC ...
H01L 23/28 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01); H01L 23/29 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01L 23/293 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/92247 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06575 (2013.01); H01L 2924/01004 (2013.01); H01L 2924/0102 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/3011 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2924/01019 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48247 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/15747 (2013.01);
Abstract

The present invention includes a temporary fixing step of temporarily fixing a semiconductor element on an adherend interposing an adhesive sheet therebetween, a wire-bonding step of bonding wires to the semiconductor element, and a step of sealing the semiconductor element with a sealing resin, and in which the loss elastic modulus of the adhesive sheet at 175-C is 2000 Pa or more.

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Misumi, Sadahito. (2015). Manufacturing method of semiconductor device, adhesive sheet used therein, and semiconductor device obtained thereby (U.S. Patent No. 8975759). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8975759

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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