The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 10, 2015
Filed:
Sep. 13, 2012
Applicants:
Sadahito Misumi, Ibaraki, JP;
Takeshi Matsumura, Ibaraki, JP;
Kazuhito Hosokawa, Ibaraki, JP;
Hiroyuki Kondo, Ibaraki, JP;
Inventors:
Sadahito Misumi, Ibaraki, JP;
Takeshi Matsumura, Ibaraki, JP;
Kazuhito Hosokawa, Ibaraki, JP;
Hiroyuki Kondo, Ibaraki, JP;
Assignee:
Nitto Denko Corporation, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/28 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01); H01L 23/29 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01L 23/293 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/92247 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06575 (2013.01); H01L 2924/01004 (2013.01); H01L 2924/0102 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/3011 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2924/01019 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48247 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/15747 (2013.01);
Abstract
The present invention includes a temporary fixing step of temporarily fixing a semiconductor element on an adherend interposing an adhesive sheet therebetween, a wire-bonding step of bonding wires to the semiconductor element, and a step of sealing the semiconductor element with a sealing resin, and in which the loss elastic modulus of the adhesive sheet at 175-C is 2000 Pa or more.