The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 10, 2015

Filed:

Jan. 09, 2008
Applicants:

Alex Chow, East Palo Alto, CA (US);

R. David Hopkins, Hayward, CA (US);

Robert J. Drost, Los Altos, CA (US);

Inventors:

Alex Chow, East Palo Alto, CA (US);

R. David Hopkins, Hayward, CA (US);

Robert J. Drost, Los Altos, CA (US);

Assignee:

Oracle America, Inc., Redwood Shores, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H01L 25/065 (2006.01); H01L 23/64 (2006.01); H01L 23/00 (2006.01); H01L 25/00 (2006.01); H04B 5/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 23/48 (2013.01); H01L 23/642 (2013.01); H01L 23/645 (2013.01); H01L 24/06 (2013.01); H01L 25/50 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05553 (2013.01); H01L 2224/16 (2013.01); H01L 2225/06513 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01027 (2013.01); H01L 2924/01051 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/14 (2013.01); H01L 2924/19015 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/30105 (2013.01); H01L 2924/30107 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01023 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01043 (2013.01); H01L 2924/01065 (2013.01); H01L 2924/01066 (2013.01); H04B 5/0012 (2013.01); H04B 5/0031 (2013.01); H04B 5/0081 (2013.01); H01L 2225/06531 (2013.01);
Abstract

A multiple access Proximity Communication system in which electrical elements on an integrated circuit chip provide the multiplexing of multiple signals to a single electrical receiving element on another chip. Multiple pads formed on one chip and receiving separate signals may be capacitively coupled to one large pad on the other chip. Multiple inductive coils on one chip may be magnetically coupled to one large coil on another chip or inductive coils on three or more chips may be used for either transmitting or receiving. The multiplexing may be based on time, frequency, or code.


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