logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8975733 B1

PDFFull Text
Date of Patent:
Mar. 10, 2015

Filed:

Feb. 20, 2013

Semiconductor device and a manufacturing method thereof

Applicant:

Renesas Electronics Corporation, Kawasaki-shi, Kanagawa, JP;

Inventors:

Yukihiro Sato, Kanagawa, JP;

Nobuya Koike, Kanagawa, JP;

Assignee:

Renesas Electronics Corporation, Kawasaki-shi, JP;

Attorney:

Miles & Stockbridge P.C.

Primary Examiner:

Nitin Parekh

Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 21/58 (2006.01); H01L 23/00 (2006.01); H01L 23/433 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49541 (2013.01); H01L 21/58 (2013.01); H01L 24/24 (2013.01); H01L 23/4334 (2013.01); H01L 23/49575 (2013.01); H01L 24/85 (2013.01); H01L 25/0657 (2013.01); H01L 2224/49171 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/13091 (2013.01); H01L 24/32 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 24/92 (2013.01); H01L 2224/291 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/451 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48145 (2013.01); H01L 2224/48245 (2013.01); H01L 2224/48463 (2013.01); H01L 2224/49177 (2013.01); H01L 2224/85181 (2013.01); H01L 2224/85205 (2013.01); H01L 2224/92247 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06506 (2013.01); H01L 2924/386 (2013.01);
Abstract

There is provided a technology enabling the improvement of the reliability of a semiconductor device manufactured by physically fixing separately formed chip mounting portion and lead frame. A feature of an embodiment resides in that, a second junction portion formed in a suspension lead is fitted into a first junction portion formed in a chip mounting portion, thereby to physically fix the chip mounting portion and the suspension lead. Specifically, the first junction portion is formed of a concave part disposed in the surface of the chip mounting portion. The second junction portion forms a part of the suspension lead.

Find Patent Forward Citations

Loading…