The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 10, 2015

Filed:

Mar. 13, 2013
Applicant:

Kabushiki Kaisha Toshiba, Tokyo, JP;

Inventors:

Akira Tojo, Naka-gun, JP;

Kazuhito Higuchi, Yokohama, JP;

Tomohiro Iguchi, Kawasaki, JP;

Masako Fukumitsu, Yokohama, JP;

Daisuke Hiratsuka, Yokohama, JP;

Akihiro Sasaki, Tokyo, JP;

Masayuki Uchida, Yokohama, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 21/50 (2006.01); H01L 23/051 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4952 (2013.01); H01L 21/50 (2013.01); H01L 23/051 (2013.01); H01L 23/49844 (2013.01); H01L 23/5389 (2013.01); H01L 24/97 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 2924/13055 (2013.01); H01L 2224/45124 (2013.01); H01L 2924/00014 (2013.01);
Abstract

According to one embodiment, a semiconductor device includes, a chip including a first chip electrode on a first surface on one side, and a second chip electrode on a second surface on the other side, an electrically conductive frame provided on a side periphery of the chip, a rewiring configured to electrically connect the second chip electrode and the electrically conductive frame on the other side of the chip, and an insulation side portion provided between the electrically conductive frame and the side periphery of the chip.


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