The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 10, 2015
Filed:
Jan. 05, 2012
Akifumi Sako, Tokyo, JP;
Tomoko Takenaka, Tokyo, JP;
Kazunari Ishida, Tokyo, JP;
Hitachi Medical Corporation, Tokyo, JP;
Abstract
Disclosed is an ultrasonic probe comprising: CMUT cells () that mutually convert ultrasonic waves and electrical signals; a semiconductor substrate () that has a plurality of the CMUT cells () formed on the surface thereof; an acoustic lens () that is provided on the front face side of the CMUT cells (); and a backing layer () that is provided on the rear face side of the semiconductor substrate (). The backing layer () is formed by a first backing layer () that makes contact with the semiconductor substrate, and a second backing layer () that is provided on the rear face side of the backing layer (). The acoustic impedance of the backing layer () is set based on the sheet thickness of the semiconductor substrate (). The backing layer () is formed by attenuating material capable of attenuating ultrasonic waves transmitted through the backing layer (). Multiple reflection of reflection echoes is suppressed by setting the acoustic impedance of the backing layer () to match the acoustic impedance of the backing layer ().