The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 10, 2015
Filed:
Mar. 08, 2012
Applicant:
Yu-chang Pai, Hsinchu County, TW;
Inventor:
Yu-Chang Pai, Hsinchu County, TW;
Assignee:
NOVATEK Microelectronics Corp., Hsinchu Science Park, Hsin-Chu, TW;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract
A lead frame package structure with low EMI includes at least a die holder each for supporting a die, and at least a lead frame each including a first terminal for connecting a printed circuit board, a second terminal for connecting the die, and a lead for connecting the first terminal and the second terminal, wherein the height of the lead is lower than the height of the first terminal and the second terminal.
Quick Actions:
Pai, Yu-Chang. (2015). Lead frame package structure with low electromagnetic interference (U.S. Patent No. 8975539). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8975539
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