The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 10, 2015
Filed:
May. 22, 2013
Applicant:
Kyocera Corporation, Kyoto-shi, Kyoto, JP;
Inventor:
Katsura Hayashi, Shiga, JP;
Assignee:
Kyocera Corporation, Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/03 (2006.01); H05K 3/46 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0306 (2013.01); H05K 3/4602 (2013.01); H05K 3/4655 (2013.01); H05K 3/4673 (2013.01); H05K 1/0271 (2013.01); H05K 1/03 (2013.01); H05K 2201/0116 (2013.01); H05K 2201/0175 (2013.01); H05K 2201/0195 (2013.01); H05K 2201/0209 (2013.01); H05K 2201/0355 (2013.01); H05K 2203/1152 (2013.01); H01L 2224/16225 (2013.01);
Abstract
A circuit substrate includes a resin layer; and an inorganic insulating layer including a groove portion penetrating the inorganic insulating layer in a thickness direction thereof. A part of the resin layer is in the groove portion.