The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 10, 2015

Filed:

Mar. 25, 2011
Applicant:

Katsura Hayashi, Yasu, JP;

Inventor:

Katsura Hayashi, Yasu, JP;

Assignee:

Kyocera Corporation, Kyoto, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/16 (2006.01); H05K 7/06 (2006.01); H05K 1/02 (2006.01); H01L 23/498 (2006.01); H01L 23/14 (2006.01); H01L 25/065 (2006.01); H01L 25/10 (2006.01); H01L 23/00 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49827 (2013.01); H01L 23/145 (2013.01); H01L 25/0657 (2013.01); H01L 25/105 (2013.01); H01L 23/49822 (2013.01); H01L 23/49894 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06572 (2013.01); H01L 2924/01004 (2013.01); H01L 2924/0102 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15331 (2013.01); H01L 2924/1579 (2013.01); H01L 2924/15798 (2013.01); H01L 2924/10342 (2013.01); H01L 23/481 (2013.01); H01L 2224/13109 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13113 (2013.01); H01L 2224/13116 (2013.01); H01L 2224/13118 (2013.01); H01L 2224/13124 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16235 (2013.01); H01L 2924/10252 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/10329 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1432 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/15172 (2013.01); H01L 2924/15192 (2013.01); H01L 2225/06548 (2013.01); H01L 2924/01012 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1058 (2013.01); H01L 23/49816 (2013.01); H01L 2224/16225 (2013.01);
Abstract

There is provided an interposer which meets the need of improving electrical reliability of an electronic device. An interposer includes a substrate including a penetrating-hole in a thickness direction thereof, and a penetrating conductor disposed in the penetrating-hole. The substrate includes a first insulating layer and a second inorganic insulating layer which are separated from each other in the thickness direction, and a first resin layer interposed between the first inorganic insulating layer and the second inorganic insulating layer and being in contact with the first inorganic insulating layer and the second inorganic insulating layer. A coefficient of thermal expansion of the first resin layer in thickness and planar directions thereof is larger than those of the first inorganic insulating layer and the second inorganic insulating layer.


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